Thermally conductive encapsulants and gels come in a wide range of adaptable products for encapsulation and potting applications. The low viscosity before cure of these products enables them to process easily and fully embed tall components, delicate wires and solder joints. They are particularly suitable for managing high heat in complicated electronic module component architectures. (NOTE: Brochure refers to these as elastomers and gels – we’ve changed to encapsulants and gels to be consistent with product page title for these products.)
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