Tantalum nitride (TaN) is an inorganic chemical compound. It is sometimes used to create barrier or "glue" layers between copper, other conductive metals, and dielectric insulator films such as thermal oxides. These films are deposited on top of silicon wafers during the manufacture of integrated circuits to create thin film surface mount resistors and have other electronic applications.
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Tantalum Nitride Sputtering Targets
Purity: 99.5%;
Circular: Diameter <= 14 inch, Thickness >= 1mm;
Block: Length <= 32 inch, Width <= 12 inch, Thickness >= 1mm.
Bonding is recommended for these materials. Many materials have characteristics that are not amenable to sputtering, such as brittleness and low thermal conductivity. This material may require a special ramp up and ramp down procedures. This process may not be necessary for other materials. Targets that have low thermal conductivity are susceptible to thermal shock.
&#; Physical Vapor Deposition (PVD)
&#; Optical
With competitive price and timely delivery, Advanced Targets sincerely hope to be your supplier and partner.
&#; Cleaning and final packaging, Cleaned for use in vacuum,
Protection from environmental contaminants
Protection during shipment
&#; 99.5% minimum purity
&#; Smaller sizes also available for R&D applications
&#; Sputtering target bonding service
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